New G464 questions

Welcome to the forum, @rhtx, my apologies for the late response. Thank you for the feedback on the ATX 205's side panel adhesives. I'll be sure to pass that along, especially given how easy it is for tempered glass to shatter on corners due to the increased pressure. The last thing we want is side panels falling off and shattering. 

For the memory DOCP profile not being loaded, that is certainly not normal. I'll pass your systems serial over to the build team so they can track down how that system got boxed up without the memory profile loaded. At the very least, it can help us improve our process to see to it that it doesn't happen again. As for your stability concerns, the memory controller of the Ryzen 9 3900X officially supports 3200mhz, so you should be perfectly fine: https://www.amd.com/en/products/cpu/amd-ryzen-9-3900x

As for HWiNFO, it reports the base SPD or Serial Presence Detect profile stored on the DIMM. This is the speed that your memory will load at prior to enabling any of the pre-defined overclocking profiles. You can use software such as CPU-Z, AIDA64 or if you still prefer HWiNFO, you can open the Sensors summary and scroll down to "Memory Timings" category and look for Memory Clock.

This should accurately report the real-time clock speed of your memory. Remember that due to the Double Data Rate nature of memory, you'll need to double that value to get your "effective" clock speed.

Hopefully this helps clarify some things, and again, thank you for bringing the situation to our attention. Should you have any further questions about your system, please do not hesitate to reach out.

rhtx said:

Awesome, thanks for the confirmation that turning on DOCP is ok and the detailed information about HWiNFO.
Do those CPU temps look ok while under full load? Do you think adding a rear exhaust would help?
Sorry one more question, just to confirm that my computer was built as expected, it appears that the included case fans have been moved to the front as intakes and the CPU AIO cooler is top mounted with the fans pushing/exhausting out the top. Is this normal? The front of the case doesn't have a magnetic dust filter and the top of the case does. It seems strange to me to be taking in unfiltered air and exhausting filtered air. I tried to fit the included magnetic filter on the front (behind the bezel, obviously) and it's not long enough to cover the whole thing. In the meantime I've ordered 3x140mm magnetic fan filters to try to put on the front, but like DOCP not being enabled out of the box, is this configuration normal?

For the CPU temps, it would depend entirely on what you are doing. For example: 80C temps while gaming is absolutely not normal, while 80C temps under synthetic stress tests using instruction sets like AVX/AVX2 (Prime95, AIDA64, Intel XTU, Linpack MKL, ASUS Realbench, etc) would be quite normal just from a physics perspective. The integrated heatspreader is only so large on a processor, so you ultimately end up producing more heat than what the limited surface area can carry away. With that being said, thermal junction on the 3900X is 95C and you still have quite a bit of headroom left. As long as you are not thermal throttling or dealing with excessive fan noise at those temps, I wouldn't be too concerned unless you saw those temps under sustained gaming loads.

As for the fan configuration, it's configured to achieve neutral/slight positive pressure with two fans set to exhaust through the top rad and two to intake through the front of the chassis. I can't imagine a rear fan helping too much with CPU temperatures as the pump/block is already moving the heat away from the surface of the CPU to the radiator and cooling the outside of the pump won't really help that. Having a rear fan as an extra intake (more positive pressure at the cost of more dust) would be beneficial if you found your VRM or memory overheating, but for CPU thermals it wouldn't make much of a difference at all.

You do bring up a very interesting point about the front intakes lack of dust filters. The current design of the chassis has the air coming through the perforated sides of the front panel as well as through the bottom lip. With my testing of the chassis, I found that the dust typically gathered in this front panel, which served as this "dust chamber", but I didn't see much dust coming through the actual fans themselves, though I imagine this would absolutely occur if given enough time without cleaning the front ventilation. I'd like to test this myself and see how well a filter would work. If you don't mind letting us know how your filters perform after you get them, I'd love to know the results.

As for whether or not DOCP being disabled out of the box is normal, I'd say no. This should be enabled after we flash our BIOS as XMP/DOCP is automatically reset once a BIOS is flashed. If DOCP was not enabled and your system is brand new, then this was an oversight on our part and we will be looking to improve our processes to avoid this mistake going forward. 

You're very welcome! As always, let us know if you have any questions whatsoever.